New Delhi: Domestic electronics parts maker Sahasra has earmarked investment of ₹350 crore over next four years for assembling mobile phone memory chipsets, laptop hard drives and motherboards in India with two new manufacturing facilities coming up in Rajasthan and Uttar Pradesh. The integrated circuit (IC) packaging plant for memory, which is being set up in Bhiwadi, Rajasthan, will entail an investment of ₹140 crore to produce 40 million ICs annually and is approved to receive support from the central government under the production-linked incentive scheme, Sahasra group managing director Amrit Manwani told ET exclusively. “Until now this was the domain of US, Japan and Taiwan where fabs would make semiconductor wafers, which would be packaged by the packaging companies,” he said. “We are getting into the packaging business. Once we have this ecosystem, the next step would be to set up a fab factory in India.”The company is aiming to scale up to 100 million IC units annually, Manwani said, and is in dialogue with major handset manufacturers including Foxconn, Wistron, Lava, Dixon, Micromax and Reliance Jio for supplying memory chipsets. “This would generate close to 750 direct jobs in the region.”
Sunday, October 25, 2020
Sahasra to invest ₹350 cr over 4 Years | Economic Times
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